Product Information

Ultraprecise grinding tool

  • CMP Conditioner REV
  • HAL-BG Wheel
  • HAL-LP Plate

CMP Conditioner REV

The main feature

Connectivity

Diamond grains are fixed extremely firm in the ceramic bond.

Maintenance of composition element

The ceramic bond does not contain any transition metals. No metal contamination.

  READ Conventional dressers
Bonding materials Ceramics Transition metals
(plated)
Transition metals
(brazed)
Hardness(Hv) 1200 600 200
Retention of diamond
Metal contamination ND level Ni Ni、Cr
  SS-W2000 READ      Brazed A.   Brazed B.  Brazed C. 
Cr 162 152 531 1,300 195
Fe 51,755 52,796 53,696 55,000 67,060
Ni <40 <40 9,265 3,900 291
Cu <40 <40 <40 <40 <40
Ag <20 <20 <20 <20 <20

CMP conditioner design

Processing example

Urethane Pad Conditioning:the status of diamond

Pad cut rate varies by CMP conditioners even using the same dressing condition

Pad surface

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