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Ultraprecise grinding tool

CMP Conditioner REV

the main feature

Connectivity

  • Diamond grains are fixed extremely firm in the ceramic bond.

Maintenance of composition element

  • The ceramic bond does not contain any transition metals. No metal contamination.

  READ Conventional dressers
Bonding materials Ceramics Transition metals
(plated)
Transition metals
(brazed)
Hardness(Hv) 1200 600 200
Retention of diamond
Metal contamination ND level Ni Ni、Cr
  SS-W2000 READ      Brazed A.   Brazed B.  Brazed C. 
Cr
162
152
531
1,300
195
Fe
51,755
52,796
53,696
55,000
67,060
Ni
<40
<40
9,265
3,900
291
Cu
<40
<40
<40
<40
<40
Ag
<20
<20
<20
<20
<20

CMP conditioner design

Processing example

Urethane Pad Conditioning:the status of diamond

Pad cut rate varies by CMP conditioners even using the same dressing condition

Pad surface

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