Product Information

Ultraprecise grinding tool

  • CMP Conditioner REV
  • HAL-BG Wheel
  • HAL-LP Plate

HAL-BG Wheel

The main feature

Ultra-smooth mirror finish due

Ultra-smooth mirror finish due to submicron abrasives

Lower grinding resistance compared

Lower grinding resistance compared to conventional wheels

Bonding material has excellent

Bonding material has excellent tribology charactetistics

Introduction

The HAL-BG wheel achieved low grinding resistance compared with an existing whetstone. It excels also in the bond characteristic, and the super-specular grinding is possible according to minute abrasive coating of submicron.

Processing example

Fine Back Grinding Wheel for Silicon Wafer

HAL-BG fine wheel formed more fine surface than conventional fine wheel.

Fine Back Grinding Wheel for Silicon Wafer

Grinding Wheel for Sapphire Wafer

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