Product Information

Ultraprecise grinding tool

HAL-BG Wheel

The main feature

Ultra-smooth mirror finish due

Ultra-smooth mirror finish due to submicron abrasives

Lower grinding resistance compared

Lower grinding resistance compared to conventional wheels

Bonding material has excellent

Bonding material has excellent tribology charactetistics


The HAL-BG wheel achieved low grinding resistance compared with an existing whetstone. It excels also in the bond characteristic, and the super-specular grinding is possible according to minute abrasive coating of submicron.

Processing example

Fine Back Grinding Wheel for Silicon Wafer

HAL-BG fine wheel formed more fine surface than conventional fine wheel.

Fine Back Grinding Wheel for Silicon Wafer

Grinding Wheel for Sapphire Wafer